Raytek can provide RDL (Re-Distribution Layer) design, mask layout, tooling preparation. Raytek possesses state-of-the-art design tools, professional and experienced designers, and a design rule checking system to fulfill customers' specific package designs.

Raytek has established the capabilities of electrical characterizations to work closely with our customers for RDL RLC extraction to optimize the design work. Our team has abundant experience in serving customers. Raytek is developing the capabilities of signal integrity (SI) and power integrity (PI), thermal, mechanical, which covers thermal resistance (still air & forced air environments), package-level mechanical stress analysis, board-level solder fatigue, and drop test analysis for FOWLP development.