Meet customer needs with quick response and the shortest delivery time.
About Raytek
Raytek Semiconductor Inc. was founded in 2016, focusing on wafer-level packaging services. It is a high-tech semiconductor company with advanced technology. Since its inception, Raytek has rooted itself in Taiwan while aiming for the global market. The company is dedicated to providing the most competitive and innovative wafer-level packaging solutions, striving to become Taiwan’s most professional wafer-level packaging technology provider. With extensive experience and technological accumulation, Raytek can offer efficient, reliable, and cost-optimized packaging services to global customers, meeting the needs of various industries and application fields.
Turnkey Service
We have a deep understanding of our customers’ needs in outsourced manufacturing management. Through close collaboration with strategic partners in packaging and testing, we provide comprehensive wafer back-end process solutions. From packaging to testing, we are committed to helping our customers reduce supply chain costs, accelerate time-to-market, and ensure quality that meets international standards.
Innovation and Trend-Driven
Accurately grasping market and technology trends, we actively promote technological R&D and application innovation.
Professional packaging technology
Specializing in wafer-level packaging, advanced processes, mass production optimization, and quality control, we stay at the forefront of the industry.
International Experience and Expertise
Our management team and core technical members come from leading global packaging companies, bringing over 20 years of hands-on industry experience.
Business Philosophy
Raytek’s Five Key Strategies
01
Business Strategy
Deepen roots in the Taiwan market while expanding a global presence.
02
Quality Strategy
03
Cost Strategy
04
Delivery Strategy
05
Marketing Strategy
Offer customized services for “high mix, low volume” production, precisely aligning with customer needs.
Core Team
Johnson Tai
Chairman / President
James Lin
Co-Founder / Special Assistant
Newman Lin
Vice President
Philip Tan
Vice President
WG Chen
Vice President
Duke Wang
Chief Financial Officer
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Core Team
Johnson Tai
Chairman / President
Experience
▪ VP, UST▪ VP, SPIL
▪ SVP, PTI
Education
National Tsing Hua University (NTHU), Department of Industrial Engineering and Engineering Management (M.S.)
James Lin
Co-Founder / Special Assistant
Experience
▪ Sr. Manager, UST▪ Director, PTI
▪ PM, TSMC
Education
University of Missouri(MU), Department of Materials Science & Engineering Institute (M.S.)
Newman Lin
Vice President
Experience
▪ Factory Manager, IST▪ Vice Director, STATS ChipPAC
▪ Director, PTI
Education
National Cheng Kung University(NCKU), Department of Chemical Engineering (M.S.)
Philip Tan
Vice President
Experience
▪ Manager, PSMC▪ Manager, Neo Solar Power
▪ Director, Raytek
Education
National Yang Ming Chiao Tung University(NYCU), Department of International College of Semiconductor Technology (M.S.)
WG Chen
Vice President
Experience
▪ VP of Ops, UNIMICRON▪ VP of QA, UNIMICRON.
▪ VP of Sales, UNIMICRON
Education
National Tsing Hua University (NTHU), Department of Power Mechanical Engineering (M.S.)
Duke Wang
Chief Financial Officer
Experience
▪ Assistant Manager, PwC Taiwan▪ Manager, Goyatek Inc.
▪ Vice Director, Raytek
Education
Chaoyang University of Technology (CYUT), Department of Finance
Milestones
2016 year
2016.04
Raytek Founded
2017 year
2017.05
1. Low volume production released
2. Launched 12” Wafer Production Line For Customization On RDL, CuP, LF Bump
2017 year
2017.06&12
1. Passed the certification of ISO 9001
2. Passed the certification of ISO 14001 & OHSAS 18001
2018 year
2018.06
1. Passed the certification of IECQ QC080000
2. Launched 6” wafer production line for customization on RDL, CuP, LF Bump, Solder Bars, and Dry Film CAP.
2020 year
2020.12
1. Passed the certification of ISO 45001
(Replaced the former OHSAS 18001 standard)
2019 year
2019.06
Launched 8” wafer production line with FSM and BGBM capabilities using Ti, NiV, and Ag
2021 year
2021.03&06
1. Passed the International Automotive Task Force certification (IATF 16949)
2. Joined the Investment Action Plan for Small and Medium Enterprises (SME) supported by the Taiwan Ministry of Economic Affairs
2022 year
2022.6
Established Bonded Factory
2024 year
2024.01&05
1. Completed Development of 8/12-inch Customized Wafer Dicing Technology (DPS)
2. Completed Development of 12-inch Silicon Photonics Wafer Customization Technology (Including RDL, CPB)
2026 year
2026.05
Listed on the TPEx Emerging Stock Board
